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瑞萨电子 RZ 系列基于 32 位和 64 位Arm®的高端微处理器 (MPU) 为未来的智能社会提供了所需的解决方案。通过各种基于 Arm Cortex®-A7、A9、A15、A53、A57 及 R4的设备,工程师可以轻松实现高分辨率人机界面 (HMI)、嵌入式视觉、嵌入式人工智能(e-AI) 和实时控制,以及工业以太网连接。
RZ 合作伙伴生态系统解决方案 | RZ 系列 MPU 的开发环境 | 成功产品组合
内置瑞萨DRP-AI 加速器,实现低功耗、高性能的AI推理。无需冷却风扇即可处理实时人工智能应用,助您开发紧凑的设计,适用于零售、机器人、家用电器和工业自动化。
基于RTOS的RZ/A 系列MPU附有出色的实时性能和快速的启动时间,结合了瑞萨电子的专有技术和Arm® 生态系统,同时保持萨电子微控制器(MCU)的易用性。
非常适合具有丰富图形的高端 HMI 应用,以及具有安全高速接口的高性能物联网边缘设备和物联网网关。支持 Arm® Cortex® 或 RISC-V 架构的 Linux 操作系统。
PLP |
Series Name |
Main CPU |
Operating Freq (Max) (MHz) |
Bit Size |
Sub CPU |
RAM (KB) |
Memory Interface |
GPU |
Accelerator |
PCIe Revision |
CAN (ch) |
Ethernet |
USB |
I/O Ports |
Pkg. Type |
Lead Count (#) |
Temp. Range |
Data Flash (KB) |
RTC |
DMA |
Timer |
ADC |
Human Machine Interface |
Security & Encryption |
Supply Voltage (V) |
CPU |
Price (USD) | 1ku |
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RTOS MPU with 10MB of On-chip RAM | 2031 3月 | RZ/A | Cortex-A9 | 400 | 32 | - | 10240 | SDRAM/66MHz (32-bit) | - | - | - | 5 | 10/100M x 1 ch | USB2.0 × 2 ch (H/F) | 171, 139 | FBGA, LFBGA, LQFP | 324, 256 | -40 to 85°C | 0 | 否 | Yes | 16-bit x 5-ch, 32-bit x 2-ch | 12-bit x 8-ch | Display Function | No | 3 - 3.6 | Cortex-A9 x 1 | 25.03 |
RTOS MPU with 3MB of On-chip RAM | 2031 3月 | RZ/A | Cortex-A9 | 400 | 32 | - | 3072 | SDRAM/66MHz (32-bit) | - | - | - | 2 | 10/100M x 1 ch | USB2.0 × 2 ch (H/F) | 100, 122 | LFBGA, LQFP | 176, 208 | -40 to 85°C | 0 | 否 | Yes | 16-bit x 5-ch, 32-bit x 2-ch | 12-bit x 8-ch | Display Function | No | 3 - 3.6 | Cortex-A9 x 1 | 11.66 |
RTOS MPU with 2MB of On-chip RAM | N/A | RZ/A | Cortex-A9 | 400 | 32 | - | 2048 | SDRAM/66MHz (32-bit) | - | - | - | 2 | 10/100M x 1 ch | USB2.0 × 2 ch (H/F) | 100 | LFBGA | 176 | -40 to 85°C | 0 | 否 | Yes | 16-bit x 5-ch, 32-bit x 2-ch | 12-bit x 8-ch | Display Function | No | 3 - 3.6 | Cortex-A9 x 1 | 7.254 |
RTOS MPU with 3MB of On-chip RAM | N/A | RZ/A | Cortex-A9 | 400 | 32 | - | 3072 | SDRAM/66MHz (32-bit) | - | - | - | 2 | 10/100M x 1 ch | USB2.0 × 2 ch (H/F) | 100, 122 | FBGA, LFBGA, LQFP | 176, 208, 233 | -40 to 85°C | 0 | 否 | Yes | 16-bit x 5-ch, 32-bit x 2-ch | 12-bit x 8-ch | Display Function | No | 3 - 3.6 | Cortex-A9 x 1 | 11.66 |
RTOS MPU with 5MB of On-chip RAM | 2031 3月 | RZ/A | Cortex-A9 | 400 | 32 | - | 5120 | SDRAM/66MHz (32-bit) | - | - | - | 5 | 10/100M x 1 ch | USB2.0 × 2 ch (H/F) | 171, 139 | FBGA, LFBGA, LQFP | 324, 256 | -40 to 85°C | 0 | 否 | Yes | 16-bit x 5-ch, 32-bit x 2-ch | 12-bit x 8-ch | Display Function | No | 3 - 3.6 | Cortex-A9 x 1 | 20.06 |
带有动态可配置处理器 (DRP) 技术,基于嵌入式人工智能的高速图像处理的微处理器 | 2031 3月 | RZ/A | Cortex-A9 | 528 | 32 | - | 4096 | -, SDRAM/132MHz (32-bit) | - | -, DRP | - | 2 | 10/100M x 2 ch | USB2.0 ×2 ch (H/F/OTG) | 70, 115, 151 | FBGA, FPBGA, LFBGA | 176, 256, 272, 324 | -40 to 85°C | 0 | 否 | Yes | 16-bit x 5-ch, 16-bit x 8-ch, 32-bit x 8-ch, 32-bit x 9-ch, 32-bit x 11-ch | 12-bit x 8-ch | Display Function | AES, Hash, No, RSA, Secure boot, TRNG | 3 - 3.6 | Cortex-A9 x 1 | 14.93 |
功能强大的 1GHz 64 位 MPU 在 RTOS 的支持下能够实现高清 HMI 和快速启动 | 2032 10月 | RZ/A | Cortex-A55 | 1000 | 64 | - | 128 | DDR3L-1333, DDR4-1600 (16-bit), OctaRAM (8-bit) | - | - | - | 2 | 10/100M/1G x 1/2 ch | USB2.0 x 2 ch (1H. 1H/F/OTG) | 82 | LFBGA | 361 | -40 to 85°C | 0 | 否 | Yes | 16-bit x 8-ch | 12-bit x 2-ch | Display Function | No | 2.97 - 3.63 | Cortex-A55 x 1 | 8.342 |
配备 RISC-V CPU 内核 (Andes AX45MP Single) (1.0 GHz) 和 2 个千兆以太网接口的通用微处理器 | 2033 5月 | RZ/G | RISC-V (AX45MP Single) | 1000 | 64 | - | 128 | DDR3L-1333, DDR4-1600 (16-bit) | - | - | - | 2 | 10/100M/1G x 1 ch, 10/100M/1G x 1/2 ch | USB2.0 x 2 ch (1H. 1H/F/OTG) | 114, 65 | LFBGA | 361, 266 | -40 to 85°C | 0 | 否 | Yes | 16-bit x 8-ch | 12-bit x 2-ch | - | AES, ECC, Hash, No, RSA, Secure boot, TRNG | 2.97 - 3.63 | RISC-V (AX45MP Single) | 8.342 |
High Performance Microprocessors with 1.0 GHz Dual-core Arm® Cortex®-A7 CPUs, with 3D Graphics and Video CODEC Engine | N/A | RZ/G | Cortex-A7 x 2 | 1000 | 32 | - | 332 | DDR3-1333 (32-bit) | PowerVR SGX540 | - | - | 2 | 10/100M x 1 ch | USB2.0 ×2 ch (1H. 1H/F) | 208 | FC-BGA | 501 | -40 to 85°C | 0 | 否 | Yes | 16-bit x 4-ch, 32-bit x 12-ch | - | Display Function | AES, Hash, RSA, TRNG | 3 - 3.6 | Cortex-A7 x 2 | 28.65 |
Ultra-high Performance Microprocessors with Quad-core Arm® Cortex®-A15 and Quad-core Arm® Cortex®-A7 CPUs, with 3D Graphics and Video CODEC Engine | N/A | RZ/G | Cortex-A15 + Cortex-A7 | 1400 | 32 | - | 332 | DDR3-1600 (32-bit) x 2 | PowerVR G6400 | - | PCIe (Rev.2.0 1Lane) x 1 ch | 2 | 10/100M x 1 ch | USB2.0 x 3 ch (2H. 1H/F), USB3.0 x 1 ch (H) | 188 | FC-BGA | 831 | -40 to 85°C | 0 | 否 | Yes | 16-bit x 4-ch, 32-bit x 12-ch | - | Display Function | No | 3 - 3.6 | Cortex-A15 x 4 + Cortex-A7 x 4 | 103.19 |
Ultra-high Performance Microprocessors with 1.5 GHz Dual-core Arm® Cortex®-A15 CPUs, with 3D Graphics and Video CODEC Engine | N/A | RZ/G | Cortex-A15 x 2 | 1500 | 32 | - | 332 | DDR3L-1600 (32-bit) x 2 | PowerVR SGX544MP2 | - | PCIe (Rev.2.0 1Lane) x 1 ch | 2 | 10/100M x 1 ch | USB2.0 x 2 ch (1H. 1H/F), USB3.0 ×1 ch (H) | 244 | FC-BGA | 831 | -40 to 85°C | 0 | 否 | Yes | 16-bit x 4-ch, 32-bit x 12-ch | - | Display Function | AES, Hash, RSA, TRNG | 3 - 3.6 | Cortex-A15 x 2 | 69.65 |
Ultra-high Performance Microprocessors with 1.5 GHz Dual-core Arm® Cortex®-A15 CPUs, with 3D Graphics and Video CODEC Engine | N/A | RZ/G | Cortex-A15 x 2 | 1500 | 32 | - | 332 | DDR3L-1600 (32-bit) x 2 | PowerVR SGX544MP2 | - | PCIe (Rev.2.0 1Lane) x 1 ch | 2 | 10/100M x 1 ch | USB2.0 x 2 ch (1H. 1H/F), USB3.0 ×1 ch (H) | 244 | FC-BGA | 831 | -40 to 85°C | 0 | 否 | Yes | 16-bit x 4-ch, 32-bit x 12-ch | - | Display Function | AES, Hash, RSA, TRNG | 3 - 3.6 | Cortex-A15 x 2 | 48.39 |
Ultra-high Performance Microprocessors with Dual-core Arm® Cortex®-A53 (1.2 GHz) CPUs, with 3D Graphics and Video CODEC Engine | N/A | RZ/G | Cortex-A53 x 2 | 1200 | 64 | Cortex-R7 | 128 | DDR3L-1856 (32-bit) | PowerVR GE8300 | - | PCIe (Rev.2.0 1Lane) x 1 ch | 2 | 10/100M x 1 ch | USB2.0 ×1 ch (H/F), USB3.0 ×1 ch (DRD) | 132 | FC-BGA | 552 | -40 to 85°C | 0 | 否 | Yes | 16-bit x 4-ch, 32-bit x 15-ch | - | Display Function | AES, Arm TrustZone, Hash, RSA, Secure boot, TRNG | 3 - 3.6 | Cortex-A53 x 2 | 28.32 |
Ultra-high Performance Microprocessors with Quad-core Arm® Cortex®-A57 and Quad-core Arm® Cortex®-A53 CPUs, with 3D Graphics and 4K Video Encoder/Decoder | N/A | RZ/G | Cortex-A57 x 4 + Cortex-A53 x 4 | 1500 | 64 | Cortex-R7 | 384 | LPDDR4-3200 (32-bit) x 2 | PowerVR GX6650 | - | PCIe (Rev.2.0 1Lane) x 2 ch | 2 | 10/100M x 1 ch | USB2.0 ×2 ch (1H. 1H/F/OTG), USB3.0 ×1 ch (DRD) | 156 | FC-BGA | 1022 | -40 to 85°C | 0 | 否 | Yes | 16-bit x 4-ch, 32-bit x 15-ch | - | Display Function | AES, AES,RSA,Hash,TRNG,Arm TrustZone,Secure boot and more... |
3.1 - 3.5 | Cortex-A57 x 4 + Cortex-A53 x 4 + Cortex-R7 x 1 | 136.8 |
配备双核 Arm® Cortex®-A55 (1.2 GHz) CPU 和单核 Arm® Cortex®-M33 (200 MHz) CPU、3D 图形加速引擎和视频编码解码引擎器的通用微处理器 | 2032 7月 | RZ/G | Cortex-A55, Cortex-A55 x 2 | 1200 | 64 | Cortex-M33 | 128 | DDR3L-1333, DDR4-1600 (16-bit), DDR4-1600 (16-bit) | Arm Mali-G31 | - | - | 2 | 10/100M/1G x 2 ch | USB2.0 ×2 ch (1H. 1H/F/OTG) | 123 | LFBGA | 551, 456 | -40 to 85°C | 0 | 否 | Yes | 16-bit x 8-ch, 32-bit x 1-ch | 12-bit x 8-ch | Display Function | AES, Arm TrustZone, ECC, Hash, No, RSA, Secure boot, TRNG | 2.97 - 3.63 | Cortex-A55 x 1 + Cortex-M33 x 1, Cortex-A55 x 2 + Cortex-M33 x 1 | 12.92 |
配备双核 Arm® Cortex®-A55 (1.2 GHz) CPU 和单核 Arm® Cortex®-M33 (200 MHz) CPU、3D 图形加速引擎的通用微处理器 | 2032 7月 | RZ/G | Cortex-A55, Cortex-A55 x 2 | 1200 | 64 | Cortex-M33 | 128 | DDR3L-1333, DDR4-1600 (16-bit), DDR4-1600 (16-bit) | Arm Mali-G31 | - | - | 2 | 10/100M/1G x 1 ch, 10/100M/1G x 2 ch | USB2.0 ×2 ch (1H. 1H/F/OTG) | 57 | LFBGA | 361 | -40 to 85°C | 0 | 否 | Yes | 16-bit x 5-ch, 32-bit x 1-ch | - | Display Function | AES, Arm TrustZone, ECC, Hash, No, RSA, Secure boot, TRNG | 2.97 - 3.63 | Cortex-A55 x 1 + Cortex-M33 x 1, Cortex-A55 x 2 + Cortex-M33 x 1 | 12.17 |
Ultra-high Performance Microprocessors with Arm® Cortex®-A57 and Arm® Cortex®-A53 CPUs, with 3D Graphics and 4K Video Encoder/Decoder | N/A | RZ/G | Cortex-A57 x 2 + Cortex-A53 x 4 | 1500 | 64 | Cortex-R7 | 384 | LPDDR4-3200 (32-bit) x 2 | PowerVR GX6250 | - | PCIe (Rev.2.0 1Lane) x 2 ch | 2 | 10/100M/1G x 1 ch | USB2.0 x 2 ch (1H. 1H/F/OTG), USB3.0 x 1 ch (DRD) | 156 | FC-BGA | 1022 | -40 to 85°C | 0 | 否 | Yes | 16-bit x 4-ch, 32-bit x 15-ch | - | Display Function | AES, Arm TrustZone, Hash, RSA, Secure boot, TRNG | 3.1 - 3.5 | Cortex-A57 x 2 + Cortex-A53 x 4 + Cortex-R7 x 1 | 67.22 |
Ultra-high Performance Microprocessors with Dual-core Arm® Cortex®-A57 (1.5 GHz) CPUs, with 3D Graphics and 4K Video Encoder/Decoder | N/A | RZ/G | Cortex-A57, Cortex-A57 x 2 | 1500 | 64 | Cortex-R7 | 384 | LPDDR4-3200 (32-bit) | PowerVR GE7800 | - | PCIe (Rev.2.0 1Lane) x 2 ch | 2 | 10/100M/1G x 1 ch | USB2.0 x 2 ch (1H. 1H/F/OTG), USB3.0 x 1 ch (DRD) | 156 | FC-BGA | 1022 | -40 to 85°C | 0 | 否 | Yes | 16-bit x 4-ch, 32-bit x 15-ch | - | Display Function | AES, AES,RSA,Hash,TRNG,Arm TrustZone,Secure boot and more... |
3.1 - 3.5 | Cortex-A57 x 2 + Cortex-R7 x 1 | 52.47 |
配备单核 Arm® Cortex®-A55 (1.0 GHz) CPU 和单核 Arm® Cortex®-M33 (200 MHz) CPU、2 个千兆以太网接口的通用微处理器 | 2032 10月 | RZ/G | Cortex-A55 | 1000 | 64 | Cortex-M33 | 128 | DDR3L-1333, DDR4-1600 (16-bit) | - | - | - | 2 | 10/100M/1G x 1 ch, 10/100M/1G x 2 ch | USB2.0 x 2 ch (1H. 1H/F/OTG) | 82, 57 | LFBGA | 361 | -40 to 85°C | 0 | 否 | Yes | 16-bit x 5-ch, 16-bit x 8-ch | -, 12-bit x 2-ch | -, Display Function | -, AES, Arm TrustZone, ECC, Hash, No, RSA, Secure boot, TRNG | 2.97 - 3.63 | Cortex-A55 x 1 + Cortex-M33 x 1 | 8.644 |
通用微处理器,采用单核 Arm® Cortex-A55® (1.1 GHz) CPU 和双核 Cortex-M33® (250 MHz) CPU,支持低功耗模式和 PCI Express | N/A | RZ/G | Cortex-A55 x 1 | 1100 | 64 | Cortex-M33 | 1024 | DDR4-1600, LPDDR4-1600 (16-bit) | - | - | PCIe (Rev.2.0 1Lane) x 1 ch | 2 | 10/100M/1G x 2 ch | USB2.0 ×2 ch (1H. 1H/F/OTG) | 82 | PBGA | 359, 361 | Ta=-40 to 85°C | 0 | 是 | Yes | 16-bit x 8-ch, 32-bit x 1-ch | 12-bit x 8-ch | - | AES, ARM TrustZone, ECC, Hash, No, RSA, Secure boot, TRNG | 3 - 3.6 | Cortex-A55 x 1 + Cortex-M33 x 1, Cortex-A55 x 1 + Cortex-M33 x 2 | 11.92 |
Microprocessors Featuring 5 Ethernet Ports and Latest Redundancy Protocol for Industrial Network Master Devices | 2030 5月 | RZ/N | Cortex-A7 x 2 | 500 | 32 | Cortex-M3 | 2048 | - | - | R-IN Engine | - | 2 | 10/100M/1G x 5 ch | USB2.0 x 2 ch (1H. 1H/F) | 170, 132 | LFBGA | 400, 324 | -40 to 110°C | 0 | 否 | Yes | 16-bit x 12-ch, 32-bit x 4-ch | 12-bit x 8-ch, 12-bit x 16-ch | Display Function | No | 3 - 3.6 | Cortex-A7 x 2 + Cortex-M3 x 1 | 20.91 |
Microprocessors with Dedicated Protocol H/W (EtherCAT/Sercos III) + R-IN Engine Covering Major Industrial Protocols | 2030 5月 | RZ/N | Cortex-M3 | 125 | 32 | Cortex-M3 | 6144 | - | - | R-IN Engine | - | 2 | 10/100M/1G x 3 ch | USB2.0 x 2 ch (1H. 1H/F) | 95 | LFBGA | 196 | -40 to 110°C | 0 | 否 | Yes | 16-bit x 12-ch, 32-bit x 4-ch | 12-bit x 8-ch | - | No | 3 - 3.6 | Cortex-M3 x 1 | 13.62 |
Microprocessors Optimized for Small PLC and HMI; Reduces Peripheral Components and Adaptable for Gateway, Sensor Hub | 2030 5月 | RZ/N | Cortex-A7 | 500 | 32 | Cortex-M3 | 6144 | - | - | R-IN Engine | - | 2 | 10/100M/1G x 5 ch | USB2.0 x 2 ch (1H. 1H/F) | 160, 95 | LFBGA | 324, 196 | -40 to 110°C | 0 | 否 | Yes | 16-bit x 12-ch, 32-bit x 4-ch | 12-bit x 8-ch | Display Function | No | 3 - 3.6 | Cortex-A7 x 1 + Cortex-M3 x 1 | 18.12 |
集成TSN三端口千兆以太网交换机, 能够在各种工业应用中轻松实现工业以太网和TSN | 2032 10月 | RZ/N | Cortex-R52 x 1 | 400 | 32 | - | 1536 | HyperRAM (8-bit), OctaRAM (8-bit), SDRAM | - | - | - | 2 | 10/100M/1G x 2 ch, 10/100M/1G x 3 ch | USB2.0 x 1 ch (1H/F/OTG) | 135, 71 | LFBGA | 225, 121 | -40 to 125°C | 0 | 是 | Yes | 16-bit x 6-ch, 16-bit x 8-ch, 32-bit x 2-ch, 32-bit x 18-ch | 12-bit x 12-ch | - | No | 3.135 - 3.465 | Cortex-R52 x 1 | 10.16 |
一个芯片实现工业设备实时控制和联网的微处理器 | 2032 12月 | RZ/T | Cortex-R4F | 300, 600, 450 | 32 | -, Cortex-M3 | 544, 1568 | - | - | -, R-IN Engine | - | 2 | 10/100M x 2 ch | USB2.0 ×2 ch (H/F) | 209, 97 | FBGA, HLQFP | 320, 176 | -40 to 125°C | 0 | 否 | Yes | 16-bit x 18-ch, 16-bit x 24-ch, 32-bit x 1-ch | 12-bit x 8-ch, 12-bit x 24-ch | - | No | 3 - 3.6 | Cortex-R4F x 1, Cortex-R4F x 1 + Cortex-M3 x 1 | 15.35 |
Equipped with a management data input / output interface (MDIO). Ideal for applications such as optical modules | N/A | RZ/T | Cortex-R4F | 450 | 32 | - | 544, 1568 | - | - | - | - | 0 | - | - | 51 | LFBGA | 112 | -40 to 110°C | 0 | 否 | Yes | 16-bit x 10-ch, 32-bit x 2-ch | 12-bit x 16-ch | - | No | 3 - 3.6 | Cortex-R4F x 1 | 21.59 |
通过 EtherCAT 实现高速、高精度实时控制的高性能 MPU | 2033 9月 | RZ/T | Cortex-R52 x 1 | 800 | 32 | 1024 | HyperRAM (8-bit), OctaRAM (8-bit), SDRAM | - | 2 | 10/100M/1G x 1 ch | USB2.0 x 1 ch (1H/F/OTG) | 111 | LFBGA | 196 | -40 to 125°C | 0 | 是 | Yes | 16-bit x 6-ch, 16-bit x 8-ch, 32-bit x 2-ch, 32-bit x 18-ch | 12-bit x 8-ch | No | 3.135 - 3.465 | Cortex-R52 x 1 | 15.08 | ||||
高性能、多功能 MPU 可实现工业 AC Servo 和控制器的高速处理和高精度控制 | 2032 8月 | RZ/T | Cortex-R52 x 1, Cortex-R52 x 2 | 800 | 32 | - | 2048, 1536 | HyperRAM (8-bit), OctaRAM (8-bit), SDRAM | - | - | - | 2 | 10/100M/1G x 3 ch | USB2.0 x 1 ch (1H/F/OTG) | 194, 135, 119, 71 | LFBGA, LFQFP | 320, 225, 176, 128 | -40 to 125°C | 0 | 否 | Yes | 16-bit x 6-ch, 16-bit x 8-ch, 32-bit x 2-ch, 32-bit x 18-ch | 12-bit x 8-ch, 12-bit x 12-ch, 12-bit x 24-ch | - | No | 3.135 - 3.465 | Cortex-R52 x 1, Cortex-R52 x 2 | 14.11 |
四核视觉 AI MPU,采用 DRP-AI3 加速器和高性能实时处理器 | N/A | RZ/V | Cortex-A55 x 4 | 1800 | 64 | Cortex-R8 x 2, Cortex-M33 | 6144 | LPDDR4-3200, LPDDR4X-3200 (32-bit) | -, Mali-G31 | DRP-AI3 | PCIe (Rev.3.0 4Lane) x 1 ch | 0 | 10/100M/1G x 2ch | USB3.2 Gen2x1 x 2 ch (2H) USB2.0 x 2 ch(1H. 1H/F/OTG ) | 86 | FC-BGA | 1368 | -40 to 125°C | 0 | 是 | Yes | 32-bit x 8-ch, 32-bit x 16-ch | 12bit x 8-ch | Display Function, Video in | AES, RSAECC, SHA-1, SHA-224, SHA-256, GHASH, TRNG, No | 3.135 - 3.465 | Cortex-A55 x 4 + Cortex-R8 x 2 + Cortex-M33 x 1 | 74.48 |
配备瑞萨电子独创的 AI 加速器“DRP-AI”、1.2GHz 双核 Arm® Cortex®-A55 CPU、3D 图形和视频编解码器引擎的通用微处理器 | 2032 7月 | RZ/V | Cortex-A55, Cortex-A55 x 2 | 1200 | 64 | Cortex-M33 | 128 | DDR3L-1333, DDR4-1600 (16-bit) | Arm Mali-G31 | DRP-AI | - | 2 | 10/100M/1G x 2 ch | USB2.0 x 2 ch (1H. 1H/F/OTG) | 123 | LFBGA | 551, 456 | -40 to 85°C | 0 | 否 | Yes | 16-bit x 8-ch, 32-bit x 2-ch, 32-bit x 8-ch | 12-bit x 8-ch | Display Function, Video In | No | 2.97 - 3.63 | Cortex-A55 x 1 + Cortex-M33 x 1, Cortex-A55 x 2 + Cortex-M33 x 1 | 19.97 |
人工智能加速器(DRP-AI),4K兼容的图像信号处理器(ISP),用于实时人类和物体识别的视觉-AI ASSP | N/A | RZ/V | Cortex-A53 x 2 | 996 | 64 | - | 1200 | LPDDR4-3200 (32-bit) | 2D Graphics Engine | DRP-AI | PCIe (Rev.2.0 2Lane) x 1 ch | 0 | 10/100M/1G x 1 ch | USB3.1 Gen1 x 1 ch (H/F) | 177 | FC-BGA, FCBGA | 841 | -40 to 125°C | 0 | 否 | Yes | 32-bit x 32-ch | 12-bit x 20-ch | Display Function | No | 3.135 - 3.465 | Cortex-A53 x 2 | 45.2 |
Vision AI MPU With Renesas DRP-AI High-efficiency AI Accelerator and OpenCV Image Processing Accelerator Enabling Real-time Object Recognition | N/A | RZ/V | Cortex-A53 x 2 | 996 | 64 | - | 1200 | LPDDR4-3200 (32-bit) | No | DRP-AI | PCIe (Rev.2.0 2Lane) x 1 ch | 0 | 10/100M/1G x 1 ch | USB3.1 Gen1 x 1 ch (H/F) | 177 | FCBGA | 841 | -40 to 125°C | 0 | 否 | Yes | 32-bit x 32-ch | 0 | No | No | 3.135 - 3.465 | Cortex-A53 x 2 | 40.88 |
Learn about the key features and advantages that the RZ/V2H MPU could bring to your next computer vision AI applications.